Wafer Plating – Stratus™ S200

ECD 100 – 200 mm Wafer Processing

Applications
  • Configurable for up to 6 metals
  • UBM/RDL
  • RF Filters
  • Power Devices
Features
  • True Bridge Tool capability
  • ShearPlate™ technology for thinnest boundary layer
  • Substrate handling flexibility
  • Safest fragile wafer handling
  • Stress control
  • Substrates
  • 100, 150, 200 mm wafers
  • Silicon, eWlb, LiNbO3/LiTaO3, GaAs, Sapphire, Bonded
Other Products