ASM NEXX is a worldwide leading supplier of metallization Advanced Packaging Deposition Equipment specializing in sputtering (PVD) and plating (ECD) processes. Our highly flexible systems offering supports:

Wafer Level Sputtering Equipment
Wafer Level Plating Equipment
Panel Level Plating Equipment

Our market focus includes: WLP, 2.5D/3D IC, TSV, Fan out, Embedded Die among many others. For more information, please contact our professional team of experienced engineers worldwide here.

SEMICON West 2019
Moscone Center, San Fransisco, CA
July 9-11, 2019
SEMICON Korea 2019
Seoul, South Korea
January 23 - 25, 2019
FOUP Standards Committee
SEMICON Japan
December 12, 2018
China Semiconductor Industry Association (CSIA)
Hefei, China
Come see Zhen Liu, November 21, 2018
IEEE Electronic Devices Society
Rochester, NY
Come see Cristina Chu, November 5, 2018
ChipScale Review
The Future of Semiconductor Packaging, Volume 22, Number 5
September - October 2018
SEMICON West 2018
San Francisco, CA, USA
July 10 to 12 2018, Come see Cristina Chu
ECTC
San Diego, CA, USA
May 30, 2018, Come see Richard Hollman