ASM NEXX is a worldwide leading supplier of metallization Advanced Packaging Deposition Equipment specializing in sputtering (PVD) and plating (ECD) processes. Our highly flexible systems offering supports:

Wafer Level Sputtering Equipment
Wafer Level Plating Equipment
Panel Level Plating Equipment

Our market focus includes: WLP, 2.5D/3D IC, TSV, Fan out, Embedded Die among many others. For more information, please contact our professional team of experienced engineers worldwide here.

IPC APEX EXPO 2020
San Diego Convention Center, Feb 4-6 2020
Come see Richard Hollman, Wednesday, February 5th at 11:00AM in 31AB, “Innovative Panel Plating for Heterogeneous Integration”
SEMICON Korea 2020
Seoul, South Korea
February 5 - February 7 2020
300th System Shipment Celebration
ASM NEXX 300th System Shipment Celebration (click Events for additional information)
ASM NEXX, Inc. Billerica Office
SEMICON EUROPA 2019
ICM Munich, November 12th-13th, Room 14A
Come see Richard Hollman at the Advanced Packaging Conference, Wed, Nov 13 11:55AM “Innovative Panel Plating for Heterogeneous Integration”
IWLPC 2019, San Jose
DoubleTree by Hilton San Jose CA
Come see Richard Hollman, Wednesday, October 23rd at 12:30 PM, “Plating for Heterogeneous Integration”
IMAPS 2019, Boston
Hynes Convention Center, 900 Boylston St, Boston, MA 02115
Come see Robert Moon, Wednesday, October 2nd at 11:30AM, “Innovative Panel Plating”
SEMICON West 2019
Moscone Center, San Fransisco, CA July 9-11 2019 Booth 6053 North Hall
Come see Ming Li and Cristina Chu
Women in Semiconductors 2019
Saratoga Hilton, Saratoga Springs, NY
Come see Cristina Chu, May 6, 2019
SEMICON SEA
Kuala Lumpur, Malaysia
Come see Dean Chng Choon Peng, May 7, 2019
SEMICON Korea 2019
Seoul, South Korea
January 23 - 25, 2019