ASM NEXX is a worldwide leading supplier of metallization Advanced Packaging Deposition Equipment specializing in sputtering (PVD) and plating (ECD) processes. Our highly flexible systems offering supports:

Wafer Level Sputtering Equipment
Wafer Level Plating Equipment
Panel Level Plating Equipment

Our market focus includes: WLP, 2.5D/3D IC, TSV, Fan out, Embedded Die among many others. For more information, please contact our professional team of experienced engineers worldwide here.

IWLPC 2019, San Jose
DoubleTree by Hilton San Jose CA
Come see Jon Hander, Wednesday, October 23rd at 12:30 PM, “Plating for Heterogeneous Integration”
IMAPS 2019, Boston
Hynes Convention Center, 900 Boylston St, Boston, MA 02115
Come see Robert Moon, Wednesday, October 2nd at 11:30AM, “Innovative Panel Plating”
SEMICON West 2019
Moscone Center, San Fransisco, CA July 9-11 2019 Booth 6053 North Hall
Come see Ming Li and Cristina Chu
Women in Semiconductors 2019
Saratoga Hilton, Saratoga Springs, NY
Come see Cristina Chu, May 6, 2019
SEMICON SEA
Kuala Lumpur, Malaysia
Come see Dean Chng Choon Peng, May 7, 2019
SEMICON Korea 2019
Seoul, South Korea
January 23 - 25, 2019
ASM NEXX’s Best Paper
Pan Pacific Microelectronics Symposium 2019
February 12, 2019
China Semiconductor Industry Association (CSIA)
Hefei, China
Come see Zhen Liu, November 21, 2018
IEEE Electronic Devices Society
Rochester, NY
Come see Cristina Chu, November 5, 2018
ChipScale Review
The Future of Semiconductor Packaging, Volume 22, Number 5
September - October 2018