ASM NEXX is a worldwide leading supplier of metallization Advanced Packaging Deposition Equipment specializing in sputtering (PVD) and plating (ECD) processes. Our highly flexible systems offering supports:

Wafer Level Sputtering Equipment
Wafer Level Plating Equipment
Panel Level Plating Equipment

Our market focus includes: WLP, 2.5D/3D IC, TSV, Fan out, Embedded Die among many others. For more information, please contact our professional team of experienced engineers worldwide here.

Apollo 300

Stratus 300

Stratus P500

Events

SEMICON West 2022
HYBRID SEMICON West 2022 offers both a [LIVE] and VIRTUAL environment
July 12 - 14 2022
SEMICON Korea 2023
Seoul, South Korea
February 9, 2023 | 10:00 am - February 11, 2023 | 12:00 pm
300th System Shipment Celebration
ASM NEXX 300th System Shipment Celebration (click Events for additional information)
ASM NEXX, Inc. Billerica Office
SEMICON EUROPA 2022
SEMICON EUROPA
November 15-18, 2022 MESSE MUNCHEN Co-located with electronica
IWLPC
IWLPC Details will be updated when available
IWLPC
IMAPS
IMAPS Details will be updated when available
IMAPS
ASM NEXX’s Best Paper
Pan Pacific Microelectronics Symposium 2019
February 12, 2019