Panel Plating – Stratus™ P500
ECD 510 x 515 mm Panel Processing
Applications
Configurable for up to 5 metals
- Multi-chip Fan Out
- SoC packages
- MicroLED
Features
- Wafer level precision hardware and software
- Cu, Sn(Ag), Ni & Au plating @<10µm L/S
- Single/Dual sided plating
- Membrane cells provide high chemistry utilization
- Multi-zone anodes for optimized uniformity with thick and thin seeds
- Patterned shields for uniform high throughput plating
Substrates
- 510×515 mm panels, custom
- Glass, Composite, Other