Panel Plating – Stratus™ P500

ECD 510 x 515 mm Panel Processing

Applications

Configurable for up to 5 metals

  • Multi-chip Fan Out
  • SoC packages
  • MicroLED
Features
  • Wafer level precision hardware and software
  • Cu, Sn(Ag), Ni & Au plating @<10µm L/S
  • Single/Dual sided plating
  • Membrane cells provide high chemistry utilization
  • Multi-zone anodes for thin and thick seeds for uniformity optimization dynamic
Substrates
  • 510×515 mm panels, custom
  • Glass, Composite, Other
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